WIDE WORK Super soft high heat dissipation gap filler WW-GAP-B series

When attached to a board, etc., it is a very soft material like gummy, so even if the mounting surface is uneven, it covers the entire contact surface, efficiently absorbs heat from each component or the entire board, and acts as a heat sink or radiator. can transfer heat.
Affix a sheet to the heat source and attach it to the radiator or housing where you want to release heat. (It is used by sandwiching it between the heat source and radiator/case).
It is a highly flexible thermal conductive material that exhibits high heat dissipation and is electrically insulating.
Since it is a very soft material, it can reduce the stress on the substrate and prevent the adverse effects of excessive pressure on the semiconductor chip.
It can be cut and used according to the application and location.
By maximizing the flexibility of the material, it has excellent conformability and cushioning to irregularities, so it has excellent adhesion to parts with different heights.
It can be effectively used for design, such as tolerance absorption.