Spesifikasi
| Cell Spacing (mm) | 2.54 |
|---|---|
| Circuit Board Dimensions, Length x Width (mm) | 70x98 |
| Display Pattern | Dot |
| Finish | Solder |
| Land | (Outer) 2.54mm pitch DIA0.9 |
| Material (Circuit Board) | Glass epoxy |
| Type | One side |
| Wall Thickness (mm) | 1.2 |
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Informasi Produk
Description
Prototype evaluation
Feature
SpecificationFor S-DIP 1.778mm pitch 28/40/64 pin
Ulasan Produk
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