Spesifikasi
| Abrasive Grain Size | #300 |
|---|---|
| File Thickness T (mm) | 1.1 |
| File Width W (mm) | 5.8 |
| Length of File | 40 |
| Length of File Part (mm) | 40 |
| Overall Length (mm) | 170 |
| Overall Length L (mm) | 170 |
| Shape | Ushira |
| Suitable Material | Hardened iron metal, stone, glass, etc. |
| Thickness (mm) | 1.1 |
| Type | S-10 |
| Width (mm) | 5.8 |
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Informasi Produk
Description
This is a diamond file with a thin overall thickness. The diamond grain size is fixed using Ni electroplating. Performance such as adhesion, grinding ability, and abrasion resistance has been improved. It uses a high-quality base metal and even higher quality diamond powder. Not only does it have high cutting performance, but it is also highly durable and allows for high-quality cutting.
For grinding high-hardness materials such as ceramics, super-hard metals, hardened steel, etc. For finishing molds and die machining correction.
For grinding high-hardness materials such as ceramics, super-hard metals, hardened steel, etc. For finishing molds and die machining correction.
Ulasan Produk
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