Ainex M.2 SSD Gap Filler Pad

Sebelum PPN:
Rp65.900
Spesifikasi
ColorBlue
Dielectric Breakdown Voltage (kV/mm)>6.5
Dimensions (mm)21x70x3
Flame retardanceUL94 V-0
Operating Temperature-40~220°C
ROHS Directive (Corresponding to 10 Substances)Correspondence
SpecificationThermal resistance: 0.792°C.in <sup>2</sup> /W
Thermal Conductivity (W/mk)2

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Informasi Produk

Description
This is a 3mm thick gap filler pad for M.2 SSDs.
Because it is thick, it can be used by placing it between the M.2 SSD and the case.
Its flexibility and elasticity make it ideal for filling uneven surfaces.
It can be attached to chipsets such as expansion cards, memory, and motherboards.
Because the material is soft, it can be cut with scissors to fit sizes such as 2230/2242/2260.
It can be cut freely and used for a variety of purposes.
It has more tack (adhesiveness) than typical thermal pads and is easier to apply.
*Various specification data are examples of measurements and are not guaranteed values.
* When removing this product, there is a risk that the product label on the surface to which it is attached may be damaged. Damage to the product label may void the product warranty.
*Since it has no adhesive strength, please use it in an environment where heat sinks, etc. are fixed with pins or screws.
*The protective film has a different front and back, but there is no front or back on the application surface.
Warning
*Various specification data are examples of measurements and are not guaranteed values.
* When removing this product, there is a risk that the product label on the surface to which it is attached may be damaged. Damage to the product label may void the product warranty.
*Since it has no adhesive strength, please use it in an environment where heat sinks, etc. are fixed with pins or screws.
*The protective film has a different front and back, but there is no front or back on the application surface.
Feature
This is a 3mm thick gap filler pad for M.2 SSDs.
Because it is thick, it can be used by placing it between the M.2 SSD and the case.
Its flexibility and elasticity make it ideal for filling uneven surfaces.
It can be attached to chipsets such as expansion cards, memory, and motherboards.
Because the material is soft, it can be cut with scissors to fit sizes such as 2230/2242/2260.
It can be cut freely and used for a variety of purposes.
It has more tack (adhesiveness) than typical thermal pads and is easier to apply.

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