SAMTEC Samtec board connection header SEARAY SEAM series

Specification
Series: SEARAYTM SEAM Pitch: 1.27mm Body Orientation: Vertical Mounting Type: Surface Mount Termination Method: Solder Type: Board-to-Board 1.27mm SEARAYTM Series Interconnects. SEARAYTM is a 1.27mm high-density, high-speed board-to-board interconnect system. The SEAM SEAF series connectors can be mapped for single-ended or differential pair applications. When routed as a single-ended system, the SEARAYTM is rated at 12.5 GHz -3 dB. The SEAM SEAF series high-speed, high-density open-pin-field arrays feature Solder Charge Technology for exceptional solder joint reliability. The SEAM SEAF series SEARAYTM high-speed, high-density open-pin-field arrays utilize Samtec's Edge Rate Contact System for high-speed performance, zippered mating, and extremely low insertion and extraction forces. High density connectors with various row counts, ideal for board stacking applications. Stack heights from 7mm with SEAF SEAM combinations. Contact resistance: 5.5mΩ. Contact plating: 0.76μm gold on contact area, matte tin on tail area.