SAMTEC Samtec board connection socket SEAF series

Specification
Number of Contacts: 400, Number of Rows: 10, Pitch: 1.27mm, Type: Board-to-Board, Mounting Type: Surface Mount, Body Orientation: Straight, Termination Method: Solder, Current Rating: 2.3A, Voltage Rating: 240 AC, Series: SEAF, Contact Material: Copper Alloy, 1.27mm SEARAYTM Series Interconnects. SEARAYTM is a 1.27mm high-density, high-speed board-to-board interconnect system. The SEAM SEAF series connectors can be mapped for single-ended or differential pair applications. When routed as a single-ended system, the SEARAYTM is rated to 12.5 GHz -3 dB. The SEAM SEAF series high-speed, high-density open-pin-field arrays utilize Solder Charge Technology for exceptional solder joint reliability. The SEAM SEAF series SEARAYTM high-speed, high-density open-pin-field arrays utilize Samtec's edge-rate contact system for high-speed performance, zippered mating, and extremely low insertion and extraction forces. High density connectors with various row counts, ideal for board stacking applications. Stack heights from 7mm with SEAF SEAM combinations. Contact resistance: 5.5mΩ. Contact plating: 0.76μm gold on contact area, matte tin on tail area.