Spesifikasi
| Finish | Through hole, gold plating, resist |
|---|---|
| Land | 2.54mm pitch 0.9DIA (outer) |
| Material (Circuit Board) | Glass epoxy |
| Type | Both sides |
| Wall Thickness (mm) | 1 |
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Informasi Produk
Description
IC package conversion
Feature
SpecificationMax.32 pin IC, 2 sheets continued
Ulasan Produk
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