Spesifikasi
| Classification | Flux: ROM1 (IPC J-STD-004C) |
|---|---|
| Content (%) | Halides: 0.18% |
| Copper Plate Corrosion | Passed (JIS Z 3197) |
| Insulation Resistance | 1x108Ω or more (JIS Z 3197) |
| Suitable For | Breakthrough in less than 50% of the test range (IPC-TM-650) |
| Type | No clean, flux: no cleaning type |
| Voltage Application | Pressure and humidity resistance test: No migration occurred (JIS Z 3197) |
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Informasi Produk
Description
It starts to absorb solder quickly, so you can complete the work in no time!
This can significantly reduce work time at sites where frequent corrections are required.
This can significantly reduce work time at sites where frequent corrections are required.
Ulasan Produk
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