Ainex Chipset gap-filling thermal putty
#Grup produk P113578845
Spesifikasi
| Color | Gray |
|---|---|
| Content (g) | 5 |
| Dielectric Breakdown Voltage (kV/mm) | >2.5 |
| Operating Temperature (°C) | -20~150 |
| ROHS Directive (Corresponding to 10 Substances) | Correspondence |
| Resistance | [Heat] 0.025°C.in2/W |
| Thermal Conductivity (W/mk) | 6 |
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Informasi Produk
Description
It is a clay-like thermally conductive putty.
It can be used by sandwiching it between the chipset and the heat sink, such as the CPU, GPU, M.2 SSD, or memory chip.
Its adjustable shape makes it ideal for filling in highly uneven surfaces.
It can be used with expansion cards, memory, motherboard chipsets, etc.
Since the shape is free, it can also accommodate M.2 SSDs of sizes such as 2230/2242/2260.
It can be freely shaped and used for a variety of purposes.
It has insulating/flame retardant properties.
Because it is non-sticky, it will not damage the surface of the item you want to cool.
*Various specification data are examples of measurements and are not guaranteed values.
*When you remove the heat sink, a clay-like putty will remain on the heat sink and heating element. Use a soft brush to remove it.
*This product has no adhesive strength, so please use it in an environment where heat sinks, etc. are fixed with pins, screws, or tape.
It can be used by sandwiching it between the chipset and the heat sink, such as the CPU, GPU, M.2 SSD, or memory chip.
Its adjustable shape makes it ideal for filling in highly uneven surfaces.
It can be used with expansion cards, memory, motherboard chipsets, etc.
Since the shape is free, it can also accommodate M.2 SSDs of sizes such as 2230/2242/2260.
It can be freely shaped and used for a variety of purposes.
It has insulating/flame retardant properties.
Because it is non-sticky, it will not damage the surface of the item you want to cool.
*Various specification data are examples of measurements and are not guaranteed values.
*When you remove the heat sink, a clay-like putty will remain on the heat sink and heating element. Use a soft brush to remove it.
*This product has no adhesive strength, so please use it in an environment where heat sinks, etc. are fixed with pins, screws, or tape.
Warning
*Various specification data are examples of measurements and are not guaranteed values.*When you remove the heat sink, a clay-like putty will remain on the heat sink and heating element. Use a soft brush to remove it.
*This product has no adhesive strength, so please use it in an environment where heat sinks, etc. are fixed with pins, screws, or tape.
Feature
It is a clay-like thermally conductive putty.It can be used by sandwiching it between the chipset and the heat sink, such as the CPU, GPU, M.2 SSD, or memory chip.
Its adjustable shape makes it ideal for filling in highly uneven surfaces.
It can be used with expansion cards, memory, motherboard chipsets, etc.
Since the shape is free, it can also accommodate M.2 SSDs of sizes such as 2230/2242/2260.
It can be freely shaped and used for a variety of purposes.
It has insulating/flame retardant properties.
Because it is non-sticky, it will not damage the surface of the item you want to cool.
Ulasan Produk
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