Apply between the CPU and the heat sink to increase heat transfer efficiency!
Apply between the CPU and the heat sink to increase the efficiency of heat conduction.
Contains nano diamond powder.
Excellent thermal performance due to very low thermal resistance.
Easy-to-handle syringe type.
Although it has very little conductivity, do not allow it to adhere to lead wires, circuits, or between terminals.
ESCO Nano diamond grease 2.8g
#Grup produk P113334153
Spesifikasi
| AS ONE Part Number | 65-2255-07 |
|---|---|
| Content (g) | 2.8 |
| Operating Temperature Range (°C) | Up to 200 (theoretical value) |
| Thermal Conductivity (W/mk) | 8.3 |
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