Spesifikasi
| Type | Both sides |
|---|---|
| Finish | Through-hole, lead-free solder leveler |
| Wall Thickness (mm) | 1 |
| Number of Pins | 8 |
| Cell Spacing (mm) | 0.65/1.27 |
| Circuit Board Dimensions, Length x Width (mm) | 10.16x12.7 |
| Hole Diameter (φmm) | 0.9 |
| Material (Circuit Board) | Glass composite |
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