MSA Wafer Hot Chuck

Sebelum PPN:
Rp99.999.900 - Rp139.999.900
Spesifikasi
Temperature Control Range (°C)R.T. to 200
Temperature Accuracy± 1.5%
Chuckable Size (inch)2 to 6
Package Size (mm)222x257x40
Power Supply (V AC)100 (at 50/60Hz)
Recommended Pumps Example1 -9197 - 02 Diaphragm Dry vacuum pumps DAP -12 S

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Informasi Produk

Warning
Image on this page only as Representative Image, Please check the specifications of each model number for details.
Feature
Uniformly heats ultra-thin workpieces such as wafers and glass substrates.
The workpiece can be fixed by vacuum suction.
Precise temperature control is possible with the attached temperature controller.

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