Spesifikasi
| Curing Condition (°C/minute) | 100/30 |
|---|---|
| Principal Component | A solution/Epoxy Plastic/silver/n-butanol/toluene/diacetone alcohol, B solution/silver/n-butanol/toluene/diacetone alcohol |
| Application | For conductive bonding of materials weak to high temperature. |
| Contents Amount (g) | 40 (Solution A 20 + Solution B 20 ) |
| Conductivity (ohm/cm) | 0.8 x 10 ^ -4 |
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