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3M Wafer De-Taping Tape 3305 is a transparent polyester film with an adhesive specifically designed for the removal of the 3M WSS adhesive from the surface of the device wafer after the carrier glass is separated from the silicon wafer.
Enables simple, low-stress, room temperature peeling of 3M Adhesives from thinned silicon wafers after glass carrier debonding
Transparency allows for inspection without tape removal
High instant adhesion to substrate
Good holding power
3M Scotch Lakban OPP Packing Box (Selotip)
#Grup produk P107013107
Spesifikasi
| Width (mm) | 48 |
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