KENTA Silica Polishing Solution

Silica polishing fluid with good grinding rate and removal rate, very suitable for tough materials such as ferrous and nonferrous metal materials, titanium, semiconductors, hard materials such as ceramics. Silica polishing solution contains a certain amount of cooling and lubricating components, to achieve the wear and tear of silicon oxide grinding and cooling, lubrication and other key performance of the effective combination of effective reduction of the grinding process of thepossibility of thermal damage, to ensure that the sample Surface finish and flatness
Applicable to all kinds of tough materials, ultra-fine polishing